Thermal Engineer
You will join a multidisciplinary R&D team that fuses mechanical design, power electronics, and materials science. The group values rapid experimentation, data-driven decisions, and sustainable innovation. Distributed across the U.S., we operate a hybrid model—onsite labs for crucial tests, remote flexibility for simulation and documentation. Expect mentorship, knowledge-sharing sessions, and a culture that celebrates curiosity.
Responsibilities
- Execute steady-state and transient CFD simulations to predict temperature fields, pressure drops, and airflow patterns.
- Craft innovative air- and liquid-cooled architectures for electronics, data centers, EV batteries, and aerospace hardware.
- Size, select, and validate heat sinks, vapor chambers, heat pipes, and cold plates that meet aggressive power density targets.
- Prepare digital twins to optimize prototypes before first hardware cut—reducing design loops by 40 %.
- Correlate analytical results with IR imaging, thermocouple arrays, and calorimetry tests; refine models accordingly.
- Write crisp technical reports that translate complex heat-transfer findings into actionable design guidance for cross-functional teams.
- Champion thermal risk reviews during design reviews and guide reliability teams on derating and safety margins.
Skills & Qualifications
- Bachelor’s or Master’s in Mechanical Engineering, Thermal Sciences, or closely related discipline.
- 5 + years hands-on experience in heat transfer, thermodynamics, and fluid dynamics.
- Proficiency in ANSYS Icepak, Flotherm, and SolidWorks Flow Simulation; familiarity with COMSOL or STAR-CCM+ a plus.
- Demonstrated record of reducing thermal resistance in densely packaged electronics.
- Strong grasp of conduction, natural and forced convection, phase-change phenomena, and radiative effects.
- Comfortable interpreting IPC, JEDEC, and ASHRAE thermal guidelines.
- Clear written and verbal communication—capable of distilling data for executives as well as fellow engineers.
Tools & Technologies
- CFD solvers (RANS & LES), FEA coupling, parametric CAD, scripting in Python/Matlab for post-processing.
- Measurement gear: high-resolution thermal cameras, fiber-optic sensors, micro-thermocouples, flow benches.
- Collaboration platforms and PLM systems enabling synchronous remote development.