● Lead engineer responsible for developing, sustaining, and validating subsystems for Etch Handlers and Process Modules within the semiconductor domain. ● Spearheaded reliability calculations and design validation for critical pressure components in vacuum subsystems, ensuring conformance with SEMI and ASME standards. ● Improved subsystem performance and reliability by addressing NSRs (Non-Standard Requests) and enhancing existing designs using Creo and NX, resulting in 25% faster assembly time. ● Conducted Alpha and Beta validation by designing and executing detailed test plans, in collaboration with field engineers, leading to a 30% reduction in design iterations. ● Reduced manufacturing costs by 18% by collaborating with the Should-Costing team and optimizing designs for manufacturability and supplier capabilities. ● Supported cross-functional teams, including Program Management, Supply Chain, and Quality, to troubleshoot issues and ensure timely part procurement and validation.

● Provided design support for semiconductor subsystem programs such as RPDP Power Box and LRT Foreline. ● Improved product manufacturability and reduced production rework by designing accurate and compliant mechanical parts using Creo and AutoCAD. ● Released complete and accurate Bill of Materials (BOM) and design documentation through PLM tools like Teamcenter, enhancing workflow efficiency. ● Addressed product lifecycle challenges by updating component specifications and collaborating with quality teams, improving release timelines by 15%.