● Smart devices require substantial power and computational resources. ● Deploying them on smart devices introduces significant hardware challenges, including tiny size, small batteries, thermal constraints, and consequentlylimited peak processing power.

● Collaborated with the TI design team within the power management productline to define system architecture and optimize power components. ● Led the research on power conversion techniques, with a focus on improvingpower efficiency and density. ● Demonstrated end-to-end hardware ownership, owning design, simulation,schematic, layout, and valuation. ● Implemented soft-switching and GaN techniques successfully, cutting systemsize by half and loss by 55% compared to the benchmark.

I worked research center, with a team of semiconductorexperts on a high-current module for advanced ASICs. ● Defined and developed new products for multiphase power converters incollaboration with TI’s design and product development teams. ● Analyzed component stresses, inductor and capacitor ripples, and transientresponse using Simplis.

Performed system State Transition Testing (STT), Stress testing. Kernel debug setup, triage. ● Lead Stress Test DOE design, setup, load, execution, monitor, analysis of S3‘testcase’ battery. ● Daily STT, Stress Testing, DOE specification. ● New equipment evaluation, qualification, and integration into test environment.